Stock:
Distributor: 108
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 152 | ₹ 7,602.38000 | ₹ 11,55,561.76 |
Stock:
Distributor: 157
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 70 | ₹ 7,740.33000 | ₹ 5,41,823.10 |
| 2 | ₹ 8,385.58000 | ₹ 16,771.16 |
Stock:
Distributor: 117
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 50 | ₹ 8,252.47000 | ₹ 4,12,623.50 |
| 25 | ₹ 8,466.46000 | ₹ 2,11,661.50 |
| 10 | ₹ 8,754.31000 | ₹ 87,543.10 |
| 1 | ₹ 9,492.74000 | ₹ 9,492.74 |
Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | I-Temp e•MMC™ | |
| IC Encapsulation Type | Tray | |
| Availability Status | Active | |
| RAM Technology Category | Non-Volatile | |
| Storage Media Type | FLASH | |
| Core Technology Platform | FLASH - NAND (TLC) | |
| Total Memory Bytes | 2Tbit | |
| Storage Layout Structure | 256G x 8 | |
| Data Access Bus | eMMC_5.1 | |
| Timing Pulse Rate | - | |
| Memory Write Speed Word/Page | - | |
| Data Retrieval Speed | - | |
| Power Supply Voltage | - | |
| Ambient Temp Range | -40°C ~ 85°C | |
| Quality Grade Level | - | |
| Certification Qualification | - | |
| Attachment Mounting Style | Surface Mount | |
| Component Housing Style | 153-VFBGA | |
| Vendor Package Type | 153-FBGA (11.5x13) |
Description
Media format FLASH for data compatibility. Memory interface eMMC_5.1 for performance and connectivity. Memory configuration 256G x 8 for efficient data access. Total memory size 2Tbit for device storage capability. Memory type Non-Volatile for efficiency and compatibility. Mounting configuration Surface Mount for structural stability. Temperature range -40°C ~ 85°C for environmental conditions impacting thermal efficiency. Type of housing Tray for safeguarding or transporting components. Style of the enclosure/case 153-VFBGA that offers mechanical and thermal protection. Type of package 153-FBGA (11.5x13) that preserves the integrity of the device. Product status Active concerning availability and lifecycle. Classification series for the product or component I-Temp e•MMC™. Supplier package type 153-FBGA (11.5x13) for component selection. The primary technology platform FLASH - NAND (TLC) linked to the product category.
