Stock:
Distributor: 160
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 10000 | ₹ 6,691.91000 | ₹ 6,69,19,100.00 |
| 1000 | ₹ 7,110.21000 | ₹ 71,10,210.00 |
| 500 | ₹ 7,528.51000 | ₹ 37,64,255.00 |
| 100 | ₹ 7,946.81000 | ₹ 7,94,681.00 |
| 25 | ₹ 8,365.11000 | ₹ 2,09,127.75 |
Stock:
Distributor: 135
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 10000 | ₹ 6,691.91000 | ₹ 6,69,19,100.00 |
| 1000 | ₹ 7,110.21000 | ₹ 71,10,210.00 |
| 500 | ₹ 7,528.51000 | ₹ 37,64,255.00 |
| 100 | ₹ 7,946.81000 | ₹ 7,94,681.00 |
| 25 | ₹ 8,365.11000 | ₹ 2,09,127.75 |
Stock:
Distributor: 111
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 10000 | ₹ 8,364.89000 | ₹ 8,36,48,900.00 |
| 1000 | ₹ 8,887.76000 | ₹ 88,87,760.00 |
| 500 | ₹ 9,410.64000 | ₹ 47,05,320.00 |
| 100 | ₹ 9,933.51000 | ₹ 9,93,351.00 |
| 25 | ₹ 10,456.39000 | ₹ 2,61,409.75 |
Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Obsolete | |
| RAM Technology Category | Volatile | |
| Storage Media Type | SRAM | |
| Core Technology Platform | - | |
| Total Memory Bytes | 16Kbit | |
| Storage Layout Structure | 16K x 1 | |
| Data Access Bus | Parallel | |
| Timing Pulse Rate | - | |
| Memory Write Speed Word/Page | 85ns | |
| Data Retrieval Speed | 85 ns | |
| Power Supply Voltage | 4.5V ~ 5.5V | |
| Ambient Temp Range | -55°C ~ 125°C (TA) | |
| Quality Grade Level | - | |
| Certification Qualification | - | |
| Attachment Mounting Style | Through Hole | |
| Component Housing Style | 20-DIP (0.300", 7.62mm) | |
| Vendor Package Type | 20-CERDIP |
Description
Provides data access speeds of 85 ns for effective data retrieval. Media format SRAM for data compatibility. Memory interface Parallel for performance and connectivity. Memory configuration 16K x 1 for efficient data access. Total memory size 16Kbit for device storage capability. Memory type Volatile for efficiency and compatibility. Mounting configuration Through Hole for structural stability. Temperature range -55°C ~ 125°C (TA) for environmental conditions impacting thermal efficiency. Type of housing Bulk for safeguarding or transporting components. Style of the enclosure/case 20-DIP (0.300", 7.62mm) that offers mechanical and thermal protection. Type of package 20-CERDIP that preserves the integrity of the device. Product status Obsolete concerning availability and lifecycle. Supplier package type 20-CERDIP for component selection. Voltage requirement 4.5V ~ 5.5V for electrical specifications. Voltage supply 4.5V ~ 5.5V for device operation. Duration required to write each word or page 85ns for memory components.
