Attribute
Description
Manufacturer Part Number
AT25512-W-11
Manufacturer
Description
IC EEPROM 512KBIT SPI WAFER
Manufacturer Lead Time
1 week
Note : GST will not be applied to orders shipping outside of India

Stock:

Distributor: 135

Quantity Unit Price Ext. Price
10000 ₹ 201.14000 ₹ 20,11,400.00
1000 ₹ 214.49000 ₹ 2,14,490.00
500 ₹ 226.95000 ₹ 1,13,475.00
100 ₹ 239.41000 ₹ 23,941.00
25 ₹ 251.87000 ₹ 6,296.75

Stock:

Distributor: 160


Quantity Unit Price Ext. Price
10000 ₹ 201.14000 ₹ 20,11,400.00
1000 ₹ 214.49000 ₹ 2,14,490.00
500 ₹ 226.95000 ₹ 1,13,475.00
100 ₹ 239.41000 ₹ 23,941.00
25 ₹ 251.87000 ₹ 6,296.75

Stock:

Distributor: 111


Quantity Unit Price Ext. Price
10000 ₹ 251.43000 ₹ 25,14,300.00
1000 ₹ 268.11000 ₹ 2,68,110.00
500 ₹ 283.69000 ₹ 1,41,845.00
112 ₹ 299.26000 ₹ 33,517.12

Stock:

Distributor: 117


Quantity Unit Price Ext. Price
85 ₹ 315.06000 ₹ 26,780.10

Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line -
IC Encapsulation Type Bulk
Availability Status Active
RAM Technology Category Non-Volatile
Storage Media Type EEPROM
Core Technology Platform EEPROM
Total Memory Bytes 512Kbit
Storage Layout Structure 64K x 8
Data Access Bus SPI
Timing Pulse Rate 20 MHz
Memory Write Speed Word/Page 5ms
Data Retrieval Speed -
Power Supply Voltage 1.8V ~ 5.5V
Ambient Temp Range -40°C ~ 85°C (TA)
Quality Grade Level -
Certification Qualification -
Attachment Mounting Style Surface Mount
Component Housing Style Die
Vendor Package Type Wafer

Description

Operates at a clock frequency of 20 MHz. Media format EEPROM for data compatibility. Memory interface SPI for performance and connectivity. Memory configuration 64K x 8 for efficient data access. Total memory size 512Kbit for device storage capability. Memory type Non-Volatile for efficiency and compatibility. Mounting configuration Surface Mount for structural stability. Temperature range -40°C ~ 85°C (TA) for environmental conditions impacting thermal efficiency. Type of housing Bulk for safeguarding or transporting components. Style of the enclosure/case Die that offers mechanical and thermal protection. Type of package Wafer that preserves the integrity of the device. Product status Active concerning availability and lifecycle. Supplier package type Wafer for component selection. Voltage requirement 1.8V ~ 5.5V for electrical specifications. The primary technology platform EEPROM linked to the product category. Voltage supply 1.8V ~ 5.5V for device operation. Duration required to write each word or page 5ms for memory components.