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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Bulk | |
| RAM Technology Category | Non-Volatile | |
| Storage Media Type | EEPROM | |
| Core Technology Platform | EEPROM | |
| Total Memory Bytes | 1Kbit | |
| Storage Layout Structure | 256 x 4 | |
| Data Access Bus | 1-Wire® | |
| Timing Pulse Rate | - | |
| Memory Write Speed Word/Page | - | |
| Data Retrieval Speed | 2 µs | |
| Power Supply Voltage | - | |
| Ambient Temp Range | -40°C ~ 85°C (TA) | |
| Quality Grade Level | - | |
| Certification Qualification | - | |
| Attachment Mounting Style | Surface Mount | |
| Component Housing Style | 2-WDFN | |
| Vendor Package Type | 2-SFN (3.5x6.5) |
Description
Provides data access speeds of 2 µs for effective data retrieval. Media format EEPROM for data compatibility. Memory interface 1-Wire® for performance and connectivity. Memory configuration 256 x 4 for efficient data access. Total memory size 1Kbit for device storage capability. Memory type Non-Volatile for efficiency and compatibility. Mounting configuration Surface Mount for structural stability. Temperature range -40°C ~ 85°C (TA) for environmental conditions impacting thermal efficiency. Type of housing Bulk for safeguarding or transporting components. Style of the enclosure/case 2-WDFN that offers mechanical and thermal protection. Type of package 2-SFN (3.5x6.5) that preserves the integrity of the device. Supplier package type 2-SFN (3.5x6.5) for component selection. The primary technology platform EEPROM linked to the product category.
