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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | HiperPFS™ | |
| IC Encapsulation Type | Tube | |
| Availability Status | Obsolete | |
| Operation Mode Type | Continuous Conduction (CCM) | |
| Switching Cycle Rate | - | |
| Initial Boot Current | - | |
| Power Supply Voltage | 10.2V ~ 13.2V | |
| Ambient Temp Range | -40°C ~ 125°C | |
| Quality Grade Level | - | |
| Certification Qualification | - | |
| Attachment Mounting Style | Through Hole | |
| Component Housing Style | 16-SSIP, 13 Leads, Exposed Pad, Formed Leads | |
| Vendor Package Type | eSIP-16D |
Description
Mode of operation Continuous Conduction (CCM) for device or system performance. Mounting configuration Through Hole for structural stability. Temperature range -40°C ~ 125°C for environmental conditions impacting thermal efficiency. Type of housing Tube for safeguarding or transporting components. Style of the enclosure/case 16-SSIP, 13 Leads, Exposed Pad, Formed Leads that offers mechanical and thermal protection. Type of package eSIP-16D that preserves the integrity of the device. Product status Obsolete concerning availability and lifecycle. Classification series for the product or component HiperPFS™. Supplier package type eSIP-16D for component selection. Voltage requirement 10.2V ~ 13.2V for electrical specifications. Voltage supply 10.2V ~ 13.2V for device operation.