Description

Provides extra interface options rated at DMA, GPIO, I2C, I2S, MMC/SD, QSPI, SPDIF, SPI, TDM, UART/USART to improve functionality. Includes co-processing or DSP components classified as ARM® Cortex®-M4F. Includes the core processor identified as ARM® Cortex®-A53 for swift processing. Incorporates display and user interface processors noted as LVDS, MIPI/CSI, MIPI-DPI, OLDI. Conforms to the Ethernet standard specified at 10/100/1000Mbps (2). Evaluated as Automotive grade for quality control. Offers a Yes boost in graphics for fluid visual performance. Mounting configuration Surface Mount for structural stability. The width of the bus or cores is 2 Core, 64-Bit for digital uses. Temperature range -40°C ~ 125°C (TJ) for environmental conditions impacting thermal efficiency. Voltage 1.1V, 1.2V, 1.8V, 3.3V for optimal output electric potential. Type of housing Tape & Reel (TR)Cut Tape (CT)Digi-Reel® for safeguarding or transporting components. Style of the enclosure/case 441-BFBGA, FCBGA that offers mechanical and thermal protection. Type of package 441-FCBGA (17.2x17.2) that preserves the integrity of the device. Product status Active concerning availability and lifecycle. Certification AEC-Q100 for compliance with testing or regulatory standards. Units that control RAM DDR4, LPDDR4 for effective memory management. Security features AES, ARM TZ, Cryptography, DRBG, ECC, MD5, PKA, Random Number Generator, RSA, Secure Boot, SHA2, SMS for device protection. Operational speed 1.4GHz for mechanical or data tasks. Supplier package type 441-FCBGA (17.2x17.2) for component selection. Version of USB USB 2.0 (2) for connectivity. Input/output voltage level 1.1V, 1.2V, 1.8V, 3.3V for digital systems.