Our team will assist you shortly.
Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | Sitara™ | |
| IC Encapsulation Type | Tape & Reel (TR)Cut Tape (CT)Digi-Reel® | |
| Availability Status | Active | |
| Central CPU Unit | ARM® Cortex®-A15 | |
| Bus Core Width Bits | 2 Core, 32-Bit | |
| Operational Speed Rating | 1.5GHz | |
| Digital Signal Processors | DSP, BB2D, IPU, IVA, GPU, VPE | |
| Memory Management Units | DDR3, SRAM | |
| GPU Speed Enhancement | Yes | |
| Screen and UI Processors | - | |
| Network Ethernet Standard | GbE (2) | |
| Serial ATA Interface | SATA 3Gbps (1) | |
| USB Interface Version | USB 2.0 (1), USB 3.0 (1) | |
| Input/Output Voltage Level | 1.8V, 3.3V | |
| Ambient Temp Range | -40°C ~ 105°C (TJ) | |
| Quality Grade Level | - | |
| Certification Qualification | - | |
| Data Protection Measures | - | |
| Attachment Mounting Style | Surface Mount | |
| Component Housing Style | 760-BFBGA, FCBGA | |
| Vendor Package Type | 760-FCBGA (23x23) | |
| Extra Connectivity Ports | CAN, EBI/EMI, HDQ/1-Wire®, I2C, McASP, McSPI, MMC/SD/SDIO, PCIe, QSPI, UART |
Description
Provides extra interface options rated at CAN, EBI/EMI, HDQ/1-Wire®, I2C, McASP, McSPI, MMC/SD/SDIO, PCIe, QSPI, UART to improve functionality. Includes co-processing or DSP components classified as DSP, BB2D, IPU, IVA, GPU, VPE. Includes the core processor identified as ARM® Cortex®-A15 for swift processing. Conforms to the Ethernet standard specified at GbE (2). Offers a Yes boost in graphics for fluid visual performance. Mounting configuration Surface Mount for structural stability. The width of the bus or cores is 2 Core, 32-Bit for digital uses. Temperature range -40°C ~ 105°C (TJ) for environmental conditions impacting thermal efficiency. Voltage 1.8V, 3.3V for optimal output electric potential. Type of housing Tape & Reel (TR)Cut Tape (CT)Digi-Reel® for safeguarding or transporting components. Style of the enclosure/case 760-BFBGA, FCBGA that offers mechanical and thermal protection. Type of package 760-FCBGA (23x23) that preserves the integrity of the device. Product status Active concerning availability and lifecycle. Units that control RAM DDR3, SRAM for effective memory management. The SATA 3Gbps (1) SATA interface for data storage applications. Classification series for the product or component Sitara™. Operational speed 1.5GHz for mechanical or data tasks. Supplier package type 760-FCBGA (23x23) for component selection. Version of USB USB 2.0 (1), USB 3.0 (1) for connectivity. Input/output voltage level 1.8V, 3.3V for digital systems.
