Description

Provides extra interface options rated at CAN, I2C, IEBus, IrDA, LIN, MediaLB, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI to improve functionality. Includes co-processing or DSP components classified as Multimedia; NEON™ MPE. Includes the core processor identified as ARM® Cortex®-A9 for swift processing. Incorporates display and user interface processors noted as VDC. Conforms to the Ethernet standard specified at 10/100Mbps. Offers a Yes boost in graphics for fluid visual performance. Mounting configuration Surface Mount for structural stability. The width of the bus or cores is 1 Core, 32-Bit for digital uses. Temperature range -40°C ~ 85°C (TA) for environmental conditions impacting thermal efficiency. Voltage 1.2V, 3.3V for optimal output electric potential. Type of housing Tray for safeguarding or transporting components. Style of the enclosure/case 208-LQFP that offers mechanical and thermal protection. Type of package 208-LFQFP (28x28) that preserves the integrity of the device. Product status Active concerning availability and lifecycle. Units that control RAM SDRAM, SRAM for effective memory management. Classification series for the product or component RZ/A1L. Operational speed 400MHz for mechanical or data tasks. Supplier package type 208-LFQFP (28x28) for component selection. Version of USB USB 2.0 (2) for connectivity. Input/output voltage level 1.2V, 3.3V for digital systems.