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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | i.MX7D | |
| IC Encapsulation Type | Tray | |
| Availability Status | Active | |
| Central CPU Unit | ARM® Cortex®-A7, ARM® Cortex®-M4 | |
| Bus Core Width Bits | 2 Core, 32-Bit | |
| Operational Speed Rating | 1.0GHz | |
| Digital Signal Processors | Multimedia; NEON™ MPE | |
| Memory Management Units | LPDDR2, LPDDR3, DDR3, DDR3L | |
| GPU Speed Enhancement | No | |
| Screen and UI Processors | Keypad, LCD, MIPI | |
| Network Ethernet Standard | 10/100/1000Mbps (2) | |
| Serial ATA Interface | - | |
| USB Interface Version | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | |
| Input/Output Voltage Level | 1.8V, 3.3V | |
| Ambient Temp Range | -20°C ~ 105°C (TJ) | |
| Quality Grade Level | - | |
| Certification Qualification | - | |
| Data Protection Measures | A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS | |
| Attachment Mounting Style | Surface Mount | |
| Component Housing Style | 488-TFBGA | |
| Vendor Package Type | 488-TFBGA (12x12) | |
| Extra Connectivity Ports | AC'97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART |
Description
Provides extra interface options rated at AC'97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART to improve functionality. Includes co-processing or DSP components classified as Multimedia; NEON™ MPE. Includes the core processor identified as ARM® Cortex®-A7, ARM® Cortex®-M4 for swift processing. Incorporates display and user interface processors noted as Keypad, LCD, MIPI. Conforms to the Ethernet standard specified at 10/100/1000Mbps (2). Offers a No boost in graphics for fluid visual performance. Mounting configuration Surface Mount for structural stability. The width of the bus or cores is 2 Core, 32-Bit for digital uses. Temperature range -20°C ~ 105°C (TJ) for environmental conditions impacting thermal efficiency. Voltage 1.8V, 3.3V for optimal output electric potential. Type of housing Tray for safeguarding or transporting components. Style of the enclosure/case 488-TFBGA that offers mechanical and thermal protection. Type of package 488-TFBGA (12x12) that preserves the integrity of the device. Product status Active concerning availability and lifecycle. Units that control RAM LPDDR2, LPDDR3, DDR3, DDR3L for effective memory management. Security features A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS for device protection. Classification series for the product or component i.MX7D. Operational speed 1.0GHz for mechanical or data tasks. Supplier package type 488-TFBGA (12x12) for component selection. Version of USB USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) for connectivity. Input/output voltage level 1.8V, 3.3V for digital systems.
