Attribute
Description
Manufacturer Part Number
MCIMX6X3EVK10ABR
Manufacturer
Description
IC MPU I.MX6SX 1GHZ 400MAPBGA
Manufacturer Lead Time
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Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line i.MX6SX
IC Encapsulation Type Tape & Reel (TR)Tape & Reel (TR)
Availability Status Not For New Designs
Central CPU Unit ARM® Cortex®-A9, ARM® Cortex®-M4
Bus Core Width Bits 2 Core, 32-Bit
Operational Speed Rating 227MHz, 1GHz
Digital Signal Processors Multimedia; NEON™ MPE
Memory Management Units LPDDR2, LVDDR3, DDR3
GPU Speed Enhancement Yes
Screen and UI Processors Keypad, LCD, LVDS
Network Ethernet Standard 10/100/1000Mbps (2)
Serial ATA Interface -
USB Interface Version USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Input/Output Voltage Level 1.8V, 2.5V, 2.8V, 3.15V
Ambient Temp Range -20°C ~ 105°C (TJ)
Quality Grade Level -
Certification Qualification -
Data Protection Measures A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Attachment Mounting Style Surface Mount
Component Housing Style 400-LFBGA
Vendor Package Type 400-MAPBGA (14x14)
Extra Connectivity Ports AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART

Description

Provides extra interface options rated at AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART to improve functionality. Includes co-processing or DSP components classified as Multimedia; NEON™ MPE. Includes the core processor identified as ARM® Cortex®-A9, ARM® Cortex®-M4 for swift processing. Incorporates display and user interface processors noted as Keypad, LCD, LVDS. Conforms to the Ethernet standard specified at 10/100/1000Mbps (2). Offers a Yes boost in graphics for fluid visual performance. Mounting configuration Surface Mount for structural stability. The width of the bus or cores is 2 Core, 32-Bit for digital uses. Temperature range -20°C ~ 105°C (TJ) for environmental conditions impacting thermal efficiency. Voltage 1.8V, 2.5V, 2.8V, 3.15V for optimal output electric potential. Type of housing Tape & Reel (TR)Tape & Reel (TR) for safeguarding or transporting components. Style of the enclosure/case 400-LFBGA that offers mechanical and thermal protection. Type of package 400-MAPBGA (14x14) that preserves the integrity of the device. Product status Not For New Designs concerning availability and lifecycle. Units that control RAM LPDDR2, LVDDR3, DDR3 for effective memory management. Security features A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE for device protection. Classification series for the product or component i.MX6SX. Operational speed 227MHz, 1GHz for mechanical or data tasks. Supplier package type 400-MAPBGA (14x14) for component selection. Version of USB USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) for connectivity. Input/output voltage level 1.8V, 2.5V, 2.8V, 3.15V for digital systems.