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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | Tariff may apply if shipping to the United States | |
| Product Series Line | i.MX6S | |
| IC Encapsulation Type | Tray | |
| Availability Status | Not For New Designs | |
| Central CPU Unit | ARM® Cortex®-A9 | |
| Bus Core Width Bits | 1 Core, 32-Bit | |
| Operational Speed Rating | 1.0GHz | |
| Digital Signal Processors | Multimedia; NEON™ SIMD | |
| Memory Management Units | LPDDR2, LVDDR3, DDR3 | |
| GPU Speed Enhancement | Yes | |
| Screen and UI Processors | Keypad, LCD | |
| Network Ethernet Standard | 10/100/1000Mbps (1) | |
| Serial ATA Interface | - | |
| USB Interface Version | USB 2.0 + PHY (4) | |
| Input/Output Voltage Level | 1.8V, 2.5V, 2.8V, 3.3V | |
| Ambient Temp Range | 0°C ~ 95°C (TJ) | |
| Quality Grade Level | - | |
| Certification Qualification | - | |
| Data Protection Measures | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | |
| Attachment Mounting Style | Surface Mount | |
| Component Housing Style | 624-LFBGA | |
| Vendor Package Type | 624-MAPBGA (21x21) | |
| Extra Connectivity Ports | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
Description
Provides extra interface options rated at CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART to improve functionality. Assesses resistance at forward current Tariff may apply if shipping to the United States for LED or diode testing. Includes co-processing or DSP components classified as Multimedia; NEON™ SIMD. Includes the core processor identified as ARM® Cortex®-A9 for swift processing. Incorporates display and user interface processors noted as Keypad, LCD. Conforms to the Ethernet standard specified at 10/100/1000Mbps (1). Offers a Yes boost in graphics for fluid visual performance. Mounting configuration Surface Mount for structural stability. The width of the bus or cores is 1 Core, 32-Bit for digital uses. Temperature range 0°C ~ 95°C (TJ) for environmental conditions impacting thermal efficiency. Voltage 1.8V, 2.5V, 2.8V, 3.3V for optimal output electric potential. Type of housing Tray for safeguarding or transporting components. Style of the enclosure/case 624-LFBGA that offers mechanical and thermal protection. Type of package 624-MAPBGA (21x21) that preserves the integrity of the device. Product status Not For New Designs concerning availability and lifecycle. Units that control RAM LPDDR2, LVDDR3, DDR3 for effective memory management. Security features ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection for device protection. Classification series for the product or component i.MX6S. Operational speed 1.0GHz for mechanical or data tasks. Supplier package type 624-MAPBGA (21x21) for component selection. The classification for import duties Tariff may apply if shipping to the United States related to import and export transactions. Version of USB USB 2.0 + PHY (4) for connectivity. Maximum Vce(on) at Vge Tariff may apply if shipping to the United States for transistor specifications. Input/output voltage level 1.8V, 2.5V, 2.8V, 3.3V for digital systems.
