Description

Provides extra interface options rated at AC'97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART to improve functionality. Includes co-processing or DSP components classified as Multimedia; NEON™ MPE. Includes the core processor identified as ARM® Cortex®-A7, ARM® Cortex®-M4 for swift processing. Incorporates display and user interface processors noted as Keypad, LCD, MIPI. Conforms to the Ethernet standard specified at 10/100/1000Mbps (2). Offers a No boost in graphics for fluid visual performance. Mounting configuration Surface Mount for structural stability. The width of the bus or cores is 2 Core, 32-Bit for digital uses. Temperature range -20°C ~ 105°C (TJ) for environmental conditions impacting thermal efficiency. Voltage 1.8V, 3.3V for optimal output electric potential. Type of housing Tray for safeguarding or transporting components. Style of the enclosure/case 541-LFBGA that offers mechanical and thermal protection. Type of package 541-MAPBGA (19x19) that preserves the integrity of the device. Product status Active concerning availability and lifecycle. Units that control RAM LPDDR2, LPDDR3, DDR3, DDR3L for effective memory management. Security features A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS for device protection. Classification series for the product or component i.MX7D. Operational speed 1.0GHz for mechanical or data tasks. Supplier package type 541-MAPBGA (19x19) for component selection. Version of USB USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) for connectivity. Input/output voltage level 1.8V, 3.3V for digital systems.