Description

Provides extra interface options rated at CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART to improve functionality. Assesses resistance at forward current Tariff may apply if shipping to the United States for LED or diode testing. Includes co-processing or DSP components classified as Multimedia; NEON™ SIMD. Includes the core processor identified as ARM® Cortex®-A7 for swift processing. Incorporates display and user interface processors noted as LCD, LVDS. Conforms to the Ethernet standard specified at 10/100Mbps (2). Offers a No boost in graphics for fluid visual performance. Mounting configuration Surface Mount for structural stability. The width of the bus or cores is 1 Core, 32-Bit for digital uses. Temperature range -40°C ~ 105°C (TJ) for environmental conditions impacting thermal efficiency. Voltage 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V for optimal output electric potential. Type of housing Tray for safeguarding or transporting components. Style of the enclosure/case 289-LFBGA that offers mechanical and thermal protection. Type of package 289-MAPBGA (14x14) that preserves the integrity of the device. Product status Active concerning availability and lifecycle. Units that control RAM LPDDR2, DDR3, DDR3L for effective memory management. Security features ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS for device protection. Classification series for the product or component i.MX6UL. Operational speed 528MHz for mechanical or data tasks. Supplier package type 289-MAPBGA (14x14) for component selection. The classification for import duties Tariff may apply if shipping to the United States related to import and export transactions. Version of USB USB 2.0 + PHY (2) for connectivity. Maximum Vce(on) at Vge Tariff may apply if shipping to the United States for transistor specifications. Input/output voltage level 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V for digital systems.