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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Active | |
| Central CPU Unit | AMD Geode™ GX1 | |
| Bus Core Width Bits | 1 Core | |
| Operational Speed Rating | 233MHz | |
| Digital Signal Processors | - | |
| Memory Management Units | - | |
| GPU Speed Enhancement | Yes | |
| Screen and UI Processors | LCD | |
| Network Ethernet Standard | - | |
| Serial ATA Interface | - | |
| USB Interface Version | USB (2) | |
| Input/Output Voltage Level | 3.3V | |
| Ambient Temp Range | 0°C ~ 85°C (TC) | |
| Quality Grade Level | - | |
| Certification Qualification | - | |
| Data Protection Measures | - | |
| Attachment Mounting Style | Surface Mount | |
| Component Housing Style | 352-BGA Exposed Pad | |
| Vendor Package Type | 352-EBGA (35x35) | |
| Extra Connectivity Ports | AC'97, DMA, GPIO, PCI |
Description
Provides extra interface options rated at AC'97, DMA, GPIO, PCI to improve functionality. Includes the core processor identified as AMD Geode™ GX1 for swift processing. Incorporates display and user interface processors noted as LCD. Offers a Yes boost in graphics for fluid visual performance. Mounting configuration Surface Mount for structural stability. The width of the bus or cores is 1 Core for digital uses. Temperature range 0°C ~ 85°C (TC) for environmental conditions impacting thermal efficiency. Voltage 3.3V for optimal output electric potential. Type of housing Bulk for safeguarding or transporting components. Style of the enclosure/case 352-BGA Exposed Pad that offers mechanical and thermal protection. Type of package 352-EBGA (35x35) that preserves the integrity of the device. Product status Active concerning availability and lifecycle. Operational speed 233MHz for mechanical or data tasks. Supplier package type 352-EBGA (35x35) for component selection. Version of USB USB (2) for connectivity. Input/output voltage level 3.3V for digital systems.