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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Active | |
| Central CPU Unit | AMD Geode™ GX | |
| Bus Core Width Bits | 1 Core | |
| Operational Speed Rating | 366MHz | |
| Digital Signal Processors | - | |
| Memory Management Units | DDR | |
| GPU Speed Enhancement | Yes | |
| Screen and UI Processors | TFT, VGA | |
| Network Ethernet Standard | - | |
| Serial ATA Interface | - | |
| USB Interface Version | - | |
| Input/Output Voltage Level | 3.3V | |
| Ambient Temp Range | 0°C ~ 85°C (TC) | |
| Quality Grade Level | - | |
| Certification Qualification | - | |
| Data Protection Measures | - | |
| Attachment Mounting Style | Surface Mount | |
| Component Housing Style | 396-BBGA | |
| Vendor Package Type | 396-TEPBGA (35x35) | |
| Extra Connectivity Ports | PCI |
Description
Provides extra interface options rated at PCI to improve functionality. Includes the core processor identified as AMD Geode™ GX for swift processing. Incorporates display and user interface processors noted as TFT, VGA. Offers a Yes boost in graphics for fluid visual performance. Mounting configuration Surface Mount for structural stability. The width of the bus or cores is 1 Core for digital uses. Temperature range 0°C ~ 85°C (TC) for environmental conditions impacting thermal efficiency. Voltage 3.3V for optimal output electric potential. Type of housing Bulk for safeguarding or transporting components. Style of the enclosure/case 396-BBGA that offers mechanical and thermal protection. Type of package 396-TEPBGA (35x35) that preserves the integrity of the device. Product status Active concerning availability and lifecycle. Units that control RAM DDR for effective memory management. Operational speed 366MHz for mechanical or data tasks. Supplier package type 396-TEPBGA (35x35) for component selection. Input/output voltage level 3.3V for digital systems.