Attribute
Description
Manufacturer Part Number
TMPM3HNFDADFG
Description
MCU, M3, 120MHZ, 512KBMEM/66KBRAM, Q
Manufacturer Lead Time
1 week
Note : GST will not be applied to orders shipping outside of India

Stock:

Distributor: 116

Quantity Unit Price Ext. Price
7200 ₹ 369.49000 ₹ 26,60,328.00
5400 ₹ 371.40000 ₹ 20,05,560.00
3600 ₹ 373.30000 ₹ 13,43,880.00
1800 ₹ 375.21000 ₹ 6,75,378.00
900 ₹ 377.11000 ₹ 3,39,399.00

Stock:

Distributor: 117


Quantity Unit Price Ext. Price
10 ₹ 466.09000 ₹ 4,660.90
1 ₹ 561.59000 ₹ 561.59

Stock:

Distributor: 108


Quantity Unit Price Ext. Price
1 ₹ 561.59000 ₹ 561.59
10 ₹ 466.36000 ₹ 4,663.60
25 ₹ 427.20000 ₹ 10,680.00
100 ₹ 395.16000 ₹ 39,516.00
900 ₹ 380.92000 ₹ 3,42,828.00

Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line TXZ+
IC Encapsulation Type Tray
Availability Status Active
Central CPU Unit ARM® Cortex®-M3
Processor Core Dimensions 32-Bit
Operational Speed Rating 120MHz
Interconnect Options I2C, SPI, UART/USART
External Device Support DMA, LVD, Motor Control PWM, POR, WDT
Input/Output Port Count 93
Firmware Storage Capacity 512KB (512K x 8)
Code Storage Technology FLASH
Non-Volatile Memory Capacity 32K x 8
Random Access Memory Bytes 64K x 8
Core Supply Voltage 2.7V ~ 5.5V
Analog-Digital Transformers A/D 17x12b SAR; D/A 2x8b
Frequency Generator Category External, Internal
Ambient Temp Range -40°C ~ 105°C
Quality Grade Level -
Certification Qualification -
Attachment Mounting Style Surface Mount
Vendor Package Type 100-QFP (14x20)
Component Housing Style 100-BQFP

Description

Presents connection choices defined by I2C, SPI, UART/USART for seamless integration. Includes the core processor identified as ARM® Cortex®-M3 for swift processing. Designed with core dimensions specified as 32-Bit. Comprises data converters classified as A/D 17x12b SAR; D/A 2x8b. Represents EEPROM capacity measured at 32K x 8. Mounting configuration Surface Mount for structural stability. Overall I/O 93 for electronic connections. Temperature range -40°C ~ 105°C for environmental conditions impacting thermal efficiency. Type of generator External, Internal for generating frequency. Type of housing Tray for safeguarding or transporting components. Style of the enclosure/case 100-BQFP that offers mechanical and thermal protection. Type of package 100-QFP (14x20) that preserves the integrity of the device. Support for external devices DMA, LVD, Motor Control PWM, POR, WDT for system integration and improvement. Product status Active concerning availability and lifecycle. Firmware storage size 512KB (512K x 8) for memory capacity. Storage medium FLASH for program retention. The total size of RAM 64K x 8 for system or device specifications. Classification series for the product or component TXZ+. Operational speed 120MHz for mechanical or data tasks. Supplier package type 100-QFP (14x20) for component selection. Voltage requirement 2.7V ~ 5.5V for electrical specifications. Vcc/Vdd voltage supply 2.7V ~ 5.5V for electronic devices.