Description

Presents connection choices defined by I2C, SPI, UART/USART for seamless integration. Includes the core processor identified as ARM® Cortex®-M3 for swift processing. Designed with core dimensions specified as 32-Bit. Comprises data converters classified as A/D 12x12b SAR; D/A 2x8b. Represents EEPROM capacity measured at 32K x 8. Mounting configuration Surface Mount for structural stability. Overall I/O 73 for electronic connections. Temperature range -40°C ~ 105°C for environmental conditions impacting thermal efficiency. Type of generator External, Internal for generating frequency. Type of housing Tray for safeguarding or transporting components. Style of the enclosure/case 80-LQFP that offers mechanical and thermal protection. Type of package 80-LQFP (12x12) that preserves the integrity of the device. Support for external devices DMA, LVD, Motor Control PWM, POR, WDT for system integration and improvement. Product status Active concerning availability and lifecycle. Firmware storage size 512KB (512K x 8) for memory capacity. Storage medium FLASH for program retention. The total size of RAM 64K x 8 for system or device specifications. Classification series for the product or component TXZ+. Operational speed 120MHz for mechanical or data tasks. Supplier package type 80-LQFP (12x12) for component selection. Voltage requirement 2.7V ~ 5.5V for electrical specifications. Vcc/Vdd voltage supply 2.7V ~ 5.5V for electronic devices.