Description

Presents connection choices defined by EBI/EMI, I2C, Microwire, SIO, SPI, SSP, UART/USART for seamless integration. Includes the core processor identified as ARM® Cortex®-M3 for swift processing. Designed with core dimensions specified as 32-Bit. Comprises data converters classified as A/D 16x10b. Mounting configuration Surface Mount for structural stability. Overall I/O 104 for electronic connections. Temperature range -20°C ~ 85°C (TA) for environmental conditions impacting thermal efficiency. Type of generator External for generating frequency. Type of housing Tray for safeguarding or transporting components. Style of the enclosure/case 144-FQFP that offers mechanical and thermal protection. Type of package 144-LQFP (20x20) that preserves the integrity of the device. Support for external devices DMA, WDT for system integration and improvement. Product status Not For New Designs concerning availability and lifecycle. Firmware storage size 1MB (1M x 8) for memory capacity. Storage medium FLASH for program retention. The total size of RAM 64K x 8 for system or device specifications. Classification series for the product or component TX03. Operational speed 64MHz for mechanical or data tasks. Supplier package type 144-LQFP (20x20) for component selection. Voltage requirement 2.7V ~ 3.6V for electrical specifications. Vcc/Vdd voltage supply 2.7V ~ 3.6V for electronic devices.