Description

Assesses resistance at forward current Tariff may apply if shipping to the United States for LED or diode testing. Presents connection choices defined by DALI, I2C, IrDA, LINbus, SmartCard, SMBus, SPI, UART/USART for seamless integration. Includes the core processor identified as ARM® Cortex®-M0+ for swift processing. Designed with core dimensions specified as 32-Bit. Comprises data converters classified as A/D 6x12b SAR. Mounting configuration Surface Mount for structural stability. Overall I/O 13 for electronic connections. Temperature range -40°C ~ 105°C (TA) for environmental conditions impacting thermal efficiency. Type of generator External, Internal for generating frequency. Type of housing Tape & Reel (TR)Cut Tape (CT)Digi-Reel® for safeguarding or transporting components. Style of the enclosure/case 16-WFQFN that offers mechanical and thermal protection. Type of package 16-WQFN (3x2) that preserves the integrity of the device. Support for external devices Brown-out Detect/Reset, DMA, POR, PWM, WDT for system integration and improvement. Product status Active concerning availability and lifecycle. Firmware storage size 32KB (32K x 8) for memory capacity. Storage medium FLASH for program retention. The total size of RAM 4K x 8 for system or device specifications. Classification series for the product or component MSPM0 L. Operational speed 32MHz for mechanical or data tasks. Supplier package type 16-WQFN (3x2) for component selection. Voltage requirement 1.62V ~ 3.6V for electrical specifications. The classification for import duties Tariff may apply if shipping to the United States related to import and export transactions. Maximum Vce(on) at Vge Tariff may apply if shipping to the United States for transistor specifications. Vcc/Vdd voltage supply 1.62V ~ 3.6V for electronic devices.