Description

Presents connection choices defined by I2C, IrDA, LINbus, SCI, SPI, UART/USART for seamless integration. Includes the core processor identified as MSP430 CPUXV2 for swift processing. Designed with core dimensions specified as 16-Bit. Comprises data converters classified as A/D 8x10b. Mounting configuration Surface Mount for structural stability. Overall I/O 17 for electronic connections. Temperature range -40°C ~ 85°C (TA) for environmental conditions impacting thermal efficiency. Type of generator Internal for generating frequency. Type of housing Tape & Reel (TR)Cut Tape (CT)Digi-Reel® for safeguarding or transporting components. Style of the enclosure/case 24-UFBGA, DSBGA that offers mechanical and thermal protection. Type of package 24-DSBGA that preserves the integrity of the device. Support for external devices Brown-out Detect/Reset, POR, PWM, WDT for system integration and improvement. Product status Active concerning availability and lifecycle. Firmware storage size 16KB (16K x 8) for memory capacity. Storage medium FRAM for program retention. The total size of RAM 1K x 8 for system or device specifications. Classification series for the product or component MSP430™ FRAM. Operational speed 24MHz for mechanical or data tasks. Supplier package type 24-DSBGA for component selection. Voltage requirement 2V ~ 3.6V for electrical specifications. Vcc/Vdd voltage supply 2V ~ 3.6V for electronic devices.