Description

Presents connection choices defined by DALI, I2C, IrDA, LINbus, SmartCard, SMBus, SPI, UART/USART for seamless integration. Includes the core processor identified as ARM® Cortex®-M0+ for swift processing. Designed with core dimensions specified as 32-Bit. Comprises data converters classified as A/D 10x12b SAR. Evaluated as Automotive grade for quality control. Mounting configuration Surface Mount for structural stability. Overall I/O 28 for electronic connections. Temperature range -40°C ~ 125°C (TA) for environmental conditions impacting thermal efficiency. Type of generator External, Internal for generating frequency. Type of housing Tape & Reel (TR)Cut Tape (CT)Digi-Reel® for safeguarding or transporting components. Style of the enclosure/case 32-TFSOP (0.118", 3.00mm Width) that offers mechanical and thermal protection. Type of package 32-VSSOP that preserves the integrity of the device. Support for external devices Brown-out Detect/Reset, DMA, POR, PWM, TRNG, WDT for system integration and improvement. Product status Active concerning availability and lifecycle. Firmware storage size 16KB (16K x 8) for memory capacity. Storage medium FLASH for program retention. Certification AEC-Q100 for compliance with testing or regulatory standards. The total size of RAM 2K x 8 for system or device specifications. Classification series for the product or component MSPM0 L. Operational speed 32MHz for mechanical or data tasks. Supplier package type 32-VSSOP for component selection. Voltage requirement 1.62V ~ 3.6V for electrical specifications. Vcc/Vdd voltage supply 1.62V ~ 3.6V for electronic devices.