Description

Presents connection choices defined by I2C, SMBus, SPI, UART/USART for seamless integration. Includes the core processor identified as CIP-51 8051 for swift processing. Designed with core dimensions specified as 8-Bit. Comprises data converters classified as A/D 12x14b; D/A 4x12b. Mounting configuration Surface Mount for structural stability. Overall I/O 20 for electronic connections. Temperature range -40°C ~ 105°C (TA) for environmental conditions impacting thermal efficiency. Type of generator Internal for generating frequency. Type of housing Tube for safeguarding or transporting components. Style of the enclosure/case 24-VFQFN Exposed Pad that offers mechanical and thermal protection. Type of package 24-QFN (3x3) that preserves the integrity of the device. Support for external devices Brown-out Detect/Reset, POR, PWM, WDT for system integration and improvement. Product status Active concerning availability and lifecycle. Firmware storage size 64KB (64K x 8) for memory capacity. Storage medium FLASH for program retention. The total size of RAM 4.25K x 8 for system or device specifications. Classification series for the product or component Laser Bee. Operational speed 72MHz for mechanical or data tasks. Supplier package type 24-QFN (3x3) for component selection. Voltage requirement 2.2V ~ 3.6V for electrical specifications. Vcc/Vdd voltage supply 2.2V ~ 3.6V for electronic devices.