Description

Presents connection choices defined by LINbus, SPI, UART/USART for seamless integration. Includes the core processor identified as 8051 for swift processing. Designed with core dimensions specified as 8-Bit. Comprises data converters classified as A/D 16x12b. Mounting configuration Surface Mount for structural stability. Overall I/O 16 for electronic connections. Temperature range -40°C ~ 125°C (TA) for environmental conditions impacting thermal efficiency. Type of generator Internal for generating frequency. Type of housing Tube for safeguarding or transporting components. Style of the enclosure/case 20-TSSOP (0.173", 4.40mm Width) that offers mechanical and thermal protection. Type of package 20-TSSOP that preserves the integrity of the device. Support for external devices Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT for system integration and improvement. Product status Not For New Designs concerning availability and lifecycle. Firmware storage size 8KB (8K x 8) for memory capacity. Storage medium FLASH for program retention. The total size of RAM 256 x 8 for system or device specifications. Classification series for the product or component C8051F53x. Operational speed 25MHz for mechanical or data tasks. Supplier package type 20-TSSOP for component selection. Voltage requirement 2V ~ 5.25V for electrical specifications. Vcc/Vdd voltage supply 2V ~ 5.25V for electronic devices.