Description

Presents connection choices defined by SMBus (2-Wire/I2C), UART/USART for seamless integration. Includes the core processor identified as 8051 for swift processing. Designed with core dimensions specified as 8-Bit. Mounting configuration Surface Mount for structural stability. Overall I/O 8 for electronic connections. Temperature range -40°C ~ 85°C (TA) for environmental conditions impacting thermal efficiency. Type of generator Internal for generating frequency. Type of housing Tube for safeguarding or transporting components. Style of the enclosure/case 10-VFDFN Exposed Pad that offers mechanical and thermal protection. Type of package 11-QFN (3x3) that preserves the integrity of the device. Support for external devices POR, PWM, WDT for system integration and improvement. Product status Not For New Designs concerning availability and lifecycle. Firmware storage size 8KB (8K x 8) for memory capacity. Storage medium FLASH for program retention. The total size of RAM 256 x 8 for system or device specifications. Classification series for the product or component C8051F30x. Operational speed 25MHz for mechanical or data tasks. Supplier package type 11-QFN (3x3) for component selection. Voltage requirement 2.7V ~ 3.6V for electrical specifications. Vcc/Vdd voltage supply 2.7V ~ 3.6V for electronic devices.