Description

Presents connection choices defined by I2C, SSP, UART/USART for seamless integration. Includes the core processor identified as nX-U16/100 for swift processing. Designed with core dimensions specified as 16-Bit. Comprises data converters classified as A/D 8x10b SAR; D/A 1x8b. Represents EEPROM capacity measured at 2K x 8. Mounting configuration Surface Mount for structural stability. Overall I/O 20 for electronic connections. Temperature range -40°C ~ 105°C (TA) for environmental conditions impacting thermal efficiency. Type of generator Internal for generating frequency. Type of housing Tape & Reel (TR)Cut Tape (CT)Digi-Reel® for safeguarding or transporting components. Style of the enclosure/case 24-WFQFN Exposed Pad that offers mechanical and thermal protection. Type of package 24-WQFN (4x4) that preserves the integrity of the device. Support for external devices POR, LED, PWM, WDT for system integration and improvement. Product status Active concerning availability and lifecycle. Firmware storage size 64KB (64K x 8) for memory capacity. Storage medium FLASH for program retention. The total size of RAM 4K x 8 for system or device specifications. Classification series for the product or component ML62Q1300. Operational speed 25MHz for mechanical or data tasks. Supplier package type 24-WQFN (4x4) for component selection. Voltage requirement 1.6V ~ 5.5V for electrical specifications. Vcc/Vdd voltage supply 1.6V ~ 5.5V for electronic devices.