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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | MCF5445x | |
| IC Encapsulation Type | Tray | |
| Availability Status | Obsolete | |
| Central CPU Unit | Coldfire V4 | |
| Processor Core Dimensions | 32-Bit | |
| Operational Speed Rating | 266MHz | |
| Interconnect Options | I2C, SPI, SSI, UART/USART, USB OTG | |
| External Device Support | DMA, WDT | |
| Input/Output Port Count | 132 | |
| Firmware Storage Capacity | - | |
| Code Storage Technology | ROMless | |
| Non-Volatile Memory Capacity | - | |
| Random Access Memory Bytes | 32K x 8 | |
| Core Supply Voltage | 1.35V ~ 3.6V | |
| Analog-Digital Transformers | - | |
| Frequency Generator Category | Internal | |
| Ambient Temp Range | 0°C ~ 70°C (TA) | |
| Quality Grade Level | - | |
| Certification Qualification | - | |
| Attachment Mounting Style | Surface Mount | |
| Vendor Package Type | 360-TEPBGA (23x23) | |
| Component Housing Style | 360-BBGA |
Description
Presents connection choices defined by I2C, SPI, SSI, UART/USART, USB OTG for seamless integration. Includes the core processor identified as Coldfire V4 for swift processing. Designed with core dimensions specified as 32-Bit. Mounting configuration Surface Mount for structural stability. Overall I/O 132 for electronic connections. Temperature range 0°C ~ 70°C (TA) for environmental conditions impacting thermal efficiency. Type of generator Internal for generating frequency. Type of housing Tray for safeguarding or transporting components. Style of the enclosure/case 360-BBGA that offers mechanical and thermal protection. Type of package 360-TEPBGA (23x23) that preserves the integrity of the device. Support for external devices DMA, WDT for system integration and improvement. Product status Obsolete concerning availability and lifecycle. Storage medium ROMless for program retention. The total size of RAM 32K x 8 for system or device specifications. Classification series for the product or component MCF5445x. Operational speed 266MHz for mechanical or data tasks. Supplier package type 360-TEPBGA (23x23) for component selection. Voltage requirement 1.35V ~ 3.6V for electrical specifications. Vcc/Vdd voltage supply 1.35V ~ 3.6V for electronic devices.
