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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | LPC3100 | |
| IC Encapsulation Type | Tray | |
| Availability Status | Obsolete | |
| Central CPU Unit | ARM9® | |
| Processor Core Dimensions | 16/32-Bit | |
| Operational Speed Rating | 208MHz | |
| Interconnect Options | EBI/EMI, I2C, Memory Card, SPI, UART/USART, USB OTG | |
| External Device Support | DMA, PWM, WDT | |
| Input/Output Port Count | 55 | |
| Firmware Storage Capacity | - | |
| Code Storage Technology | ROMless | |
| Non-Volatile Memory Capacity | - | |
| Random Access Memory Bytes | 64K x 8 | |
| Core Supply Voltage | 1.1V ~ 3.3V | |
| Analog-Digital Transformers | A/D 3x10b | |
| Frequency Generator Category | External | |
| Ambient Temp Range | -40°C ~ 85°C (TA) | |
| Quality Grade Level | - | |
| Certification Qualification | - | |
| Attachment Mounting Style | Surface Mount | |
| Vendor Package Type | 320-LFBGA (13x13) | |
| Component Housing Style | 320-LFBGA |
Description
Presents connection choices defined by EBI/EMI, I2C, Memory Card, SPI, UART/USART, USB OTG for seamless integration. Includes the core processor identified as ARM9® for swift processing. Designed with core dimensions specified as 16/32-Bit. Comprises data converters classified as A/D 3x10b. Mounting configuration Surface Mount for structural stability. Overall I/O 55 for electronic connections. Temperature range -40°C ~ 85°C (TA) for environmental conditions impacting thermal efficiency. Type of generator External for generating frequency. Type of housing Tray for safeguarding or transporting components. Style of the enclosure/case 320-LFBGA that offers mechanical and thermal protection. Type of package 320-LFBGA (13x13) that preserves the integrity of the device. Support for external devices DMA, PWM, WDT for system integration and improvement. Product status Obsolete concerning availability and lifecycle. Storage medium ROMless for program retention. The total size of RAM 64K x 8 for system or device specifications. Classification series for the product or component LPC3100. Operational speed 208MHz for mechanical or data tasks. Supplier package type 320-LFBGA (13x13) for component selection. Voltage requirement 1.1V ~ 3.3V for electrical specifications. Vcc/Vdd voltage supply 1.1V ~ 3.3V for electronic devices.
