Description

Presents connection choices defined by I2C, IrDA, LINbus, PMP, SPI, UART/USART, USB OTG for seamless integration. Includes the core processor identified as PIC for swift processing. Designed with core dimensions specified as 16-Bit. Comprises data converters classified as A/D 50x12b, 2x16b; D/A 2x10b. Mounting configuration Surface Mount for structural stability. Overall I/O 85 for electronic connections. Temperature range -40°C ~ 85°C (TA) for environmental conditions impacting thermal efficiency. Type of generator Internal for generating frequency. Type of housing Tray for safeguarding or transporting components. Style of the enclosure/case 100-TQFP that offers mechanical and thermal protection. Type of package 100-TQFP (12x12) that preserves the integrity of the device. Support for external devices Brown-out Detect/Reset, LCD, LVD, POR, PWM, WDT for system integration and improvement. Product status Active concerning availability and lifecycle. Firmware storage size 128KB (43K x 24) for memory capacity. Storage medium FLASH for program retention. The total size of RAM 8K x 8 for system or device specifications. Classification series for the product or component PIC® XLP™ 24F. Operational speed 32MHz for mechanical or data tasks. Supplier package type 100-TQFP (12x12) for component selection. Voltage requirement 2V ~ 3.6V for electrical specifications. Vcc/Vdd voltage supply 2V ~ 3.6V for electronic devices.