Description

Presents connection choices defined by I2C, LINbus, SPI, UART/USART for seamless integration. Includes the core processor identified as PIC for swift processing. Designed with core dimensions specified as 8-Bit. Comprises data converters classified as A/D 17x10b; D/A 1x5b. Represents EEPROM capacity measured at 224 x 8. Mounting configuration Surface Mount for structural stability. Overall I/O 18 for electronic connections. Temperature range -40°C ~ 85°C (TA) for environmental conditions impacting thermal efficiency. Type of generator Internal for generating frequency. Type of housing Tape & Reel (TR)Cut Tape (CT)Digi-Reel® for safeguarding or transporting components. Style of the enclosure/case 20-UFQFN Exposed Pad that offers mechanical and thermal protection. Type of package 20-UQFN (4x4) that preserves the integrity of the device. Support for external devices Brown-out Detect/Reset, POR, PWM, WDT for system integration and improvement. Product status Active concerning availability and lifecycle. Firmware storage size 14KB (8K x 14) for memory capacity. Storage medium FLASH for program retention. The total size of RAM 1K x 8 for system or device specifications. Classification series for the product or component PIC® XLP™ 16F. Operational speed 32MHz for mechanical or data tasks. Supplier package type 20-UQFN (4x4) for component selection. Voltage requirement 1.8V ~ 3.6V for electrical specifications. Vcc/Vdd voltage supply 1.8V ~ 3.6V for electronic devices.