Description

Presents connection choices defined by CANbus, I2C, IrDA, LINbus, SPI, UART/USART for seamless integration. Includes the core processor identified as dsPIC for swift processing. Designed with core dimensions specified as 16-Bit. Comprises data converters classified as A/D 20x12b; D/A 3x12b. Mounting configuration Surface Mount for structural stability. Overall I/O 53 for electronic connections. Temperature range -40°C ~ 85°C (TA) for environmental conditions impacting thermal efficiency. Type of generator Internal for generating frequency. Type of housing Tube for safeguarding or transporting components. Style of the enclosure/case 64-VFQFN Exposed Pad that offers mechanical and thermal protection. Type of package 64-QFN (9x9) that preserves the integrity of the device. Support for external devices Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, QEI, WDT for system integration and improvement. Product status Active concerning availability and lifecycle. Firmware storage size 64KB (64K x 8) for memory capacity. Storage medium FLASH for program retention. The total size of RAM 8K x 8 for system or device specifications. Classification series for the product or component dsPIC™ 33CK, Functional Safety (FuSa). Operational speed 100MHz for mechanical or data tasks. Supplier package type 64-QFN (9x9) for component selection. Voltage requirement 3V ~ 3.6V for electrical specifications. Vcc/Vdd voltage supply 3V ~ 3.6V for electronic devices.