Description

Presents connection choices defined by I2C, LINbus, SPI, UART/USART for seamless integration. Includes the core processor identified as ARM® Cortex®-M0 for swift processing. Designed with core dimensions specified as 32-Bit. Comprises data converters classified as A/D 11x12b. Mounting configuration Surface Mount for structural stability. Overall I/O 11 for electronic connections. Temperature range -40°C ~ 105°C (TA) for environmental conditions impacting thermal efficiency. Type of generator Internal for generating frequency. Type of housing Tape & Reel (TR)Cut Tape (CT)Digi-Reel® for safeguarding or transporting components. Style of the enclosure/case 16-TSSOP (0.173", 4.40mm Width) that offers mechanical and thermal protection. Type of package PG-TSSOP-16-8 that preserves the integrity of the device. Support for external devices Brown-out Detect/Reset, I2S, POR, PWM, WDT for system integration and improvement. Product status Active concerning availability and lifecycle. Firmware storage size 16KB (16K x 8) for memory capacity. Storage medium FLASH for program retention. The total size of RAM 16K x 8 for system or device specifications. Classification series for the product or component XMC1000. Operational speed 32MHz for mechanical or data tasks. Supplier package type PG-TSSOP-16-8 for component selection. Voltage requirement 1.8V ~ 5.5V for electrical specifications. Vcc/Vdd voltage supply 1.8V ~ 5.5V for electronic devices.