Description

Presents connection choices defined by I2C, IrDA, LINbus, SPI, UART/USART for seamless integration. Includes the core processor identified as ARM® Cortex®-M0+ for swift processing. Designed with core dimensions specified as 32-Bit. Comprises data converters classified as A/D 16x10b Slope, 16x12b SAR; D/A 2xIDAC. Mounting configuration Surface Mount for structural stability. Overall I/O 31 for electronic connections. Temperature range -40°C ~ 85°C (TA) for environmental conditions impacting thermal efficiency. Type of generator Internal for generating frequency. Type of housing Tape & Reel (TR)Cut Tape (CT)Digi-Reel® for safeguarding or transporting components. Style of the enclosure/case 35-XFBGA, WLCSP that offers mechanical and thermal protection. Type of package 35-WLCSP (2.11x2.6) that preserves the integrity of the device. Support for external devices Brown-out Detect/Reset, CapSense, LCD, POR, PWM, WDT for system integration and improvement. Product status Active concerning availability and lifecycle. Firmware storage size 64KB (64K x 8) for memory capacity. Storage medium FLASH for program retention. The total size of RAM 8K x 8 for system or device specifications. Classification series for the product or component PSOC™ 4 CY8C4100S. Operational speed 48MHz for mechanical or data tasks. Supplier package type 35-WLCSP (2.11x2.6) for component selection. Voltage requirement 1.71V ~ 5.5V for electrical specifications. Vcc/Vdd voltage supply 1.71V ~ 5.5V for electronic devices.