Description

Presents connection choices defined by CSI, FIFO, I2C, MMC/SD/SDIO, SPI, UART/USART, USB for seamless integration. Includes the core processor identified as ARM® Cortex®-M4F for swift processing. Designed with core dimensions specified as 32-Bit. Comprises data converters classified as A/D 8x12b SAR. Mounting configuration Surface Mount for structural stability. Overall I/O 60 for electronic connections. Temperature range -40°C ~ 105°C for environmental conditions impacting thermal efficiency. Type of generator External, Internal for generating frequency. Type of housing Tray for safeguarding or transporting components. Style of the enclosure/case 144-LFBGA, CSPBGA that offers mechanical and thermal protection. Type of package 144-CSBGA (12x12) that preserves the integrity of the device. Support for external devices Brown-out Detect/Reset, DMA, POR, PWM, Temp Sensor, WDT for system integration and improvement. Product status Active concerning availability and lifecycle. Firmware storage size 2.5MB (2.5M x 8) for memory capacity. Storage medium FLASH for program retention. The total size of RAM 384K x 8 for system or device specifications. Operational speed 120MHz for mechanical or data tasks. Supplier package type 144-CSBGA (12x12) for component selection. Voltage requirement 2.85V ~ 3.6V for electrical specifications. Vcc/Vdd voltage supply 2.85V ~ 3.6V for electronic devices.