Description

Presents connection choices defined by I2C, MDIO, SPI for seamless integration. Includes the core processor identified as ARM® Cortex®-M3 for swift processing. Designed with core dimensions specified as 32-Bit. Comprises data converters classified as A/D 16x12b; D/A 8x12b. Mounting configuration Surface Mount for structural stability. Temperature range -40°C ~ 105°C (TC) for environmental conditions impacting thermal efficiency. Type of generator External for generating frequency. Type of housing Tray for safeguarding or transporting components. Style of the enclosure/case 96-TFBGA, CSPBGA that offers mechanical and thermal protection. Type of package 96-CSPBGA (6x6) that preserves the integrity of the device. Support for external devices POR, PWM, WDT for system integration and improvement. Product status Active concerning availability and lifecycle. Firmware storage size 256KB (256K x 8) for memory capacity. Storage medium FLASH for program retention. The total size of RAM 32K x 8 for system or device specifications. Classification series for the product or component ADuCM. Operational speed 80MHz for mechanical or data tasks. Supplier package type 96-CSPBGA (6x6) for component selection. Voltage requirement 2.9V ~ 3.6V for electrical specifications. Vcc/Vdd voltage supply 2.9V ~ 3.6V for electronic devices.