Description

Presents connection choices defined by I2C, SPI, UART/USART for seamless integration. Includes the core processor identified as 8052 for swift processing. Designed with core dimensions specified as 8-Bit. Comprises data converters classified as A/D 8x12b; D/A 2x12b. Mounting configuration Surface Mount for structural stability. Overall I/O 32 for electronic connections. Temperature range -40°C ~ 85°C (TA) for environmental conditions impacting thermal efficiency. Type of generator Internal for generating frequency. Type of housing Tray for safeguarding or transporting components. Style of the enclosure/case 52-QFP that offers mechanical and thermal protection. Type of package 52-MQFP (10x10) that preserves the integrity of the device. Support for external devices DMA, PSM, PWM, Temp Sensor, WDT for system integration and improvement. Product status Active concerning availability and lifecycle. Firmware storage size 62KB (62K x 8) for memory capacity. Storage medium FLASH for program retention. The total size of RAM 2.25K x 8 for system or device specifications. Classification series for the product or component MicroConverter® ADuC8xx. Operational speed 20MHz for mechanical or data tasks. Supplier package type 52-MQFP (10x10) for component selection. Voltage requirement 4.75V ~ 5.25V for electrical specifications. Vcc/Vdd voltage supply 4.75V ~ 5.25V for electronic devices.