Stock:
Distributor: 160
| Quantity | Unit Price | Ext. Price |
|---|---|---|
| 10000 | ₹ 407.62000 | ₹ 40,76,200.00 |
| 1000 | ₹ 432.54000 | ₹ 4,32,540.00 |
| 500 | ₹ 458.35000 | ₹ 2,29,175.00 |
| 100 | ₹ 483.27000 | ₹ 48,327.00 |
| 25 | ₹ 509.08000 | ₹ 12,727.00 |
Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Tray | |
| Central CPU Unit | ARM7® | |
| Processor Core Dimensions | 16/32-Bit | |
| Operational Speed Rating | 20.48MHz | |
| Interconnect Options | LINbus, SPI | |
| External Device Support | POR, Temp Sensor, WDT | |
| Input/Output Port Count | 6 | |
| Firmware Storage Capacity | 64KB (32K x 16) | |
| Code Storage Technology | FLASH | |
| Non-Volatile Memory Capacity | - | |
| Random Access Memory Bytes | 1K x 32 | |
| Core Supply Voltage | 3.5V ~ 18V | |
| Analog-Digital Transformers | A/D 2x16b | |
| Frequency Generator Category | Internal | |
| Ambient Temp Range | -40°C ~ 115°C (TA) | |
| Quality Grade Level | Automotive | |
| Certification Qualification | - | |
| Attachment Mounting Style | Surface Mount | |
| Vendor Package Type | 32-LFCSP-VQ (6x6) | |
| Component Housing Style | 32-VFQFN Exposed Pad, CSP |
Description
Presents connection choices defined by LINbus, SPI for seamless integration. Includes the core processor identified as ARM7® for swift processing. Designed with core dimensions specified as 16/32-Bit. Comprises data converters classified as A/D 2x16b. Evaluated as Automotive grade for quality control. Mounting configuration Surface Mount for structural stability. Overall I/O 6 for electronic connections. Temperature range -40°C ~ 115°C (TA) for environmental conditions impacting thermal efficiency. Type of generator Internal for generating frequency. Type of housing Tray for safeguarding or transporting components. Style of the enclosure/case 32-VFQFN Exposed Pad, CSP that offers mechanical and thermal protection. Type of package 32-LFCSP-VQ (6x6) that preserves the integrity of the device. Support for external devices POR, Temp Sensor, WDT for system integration and improvement. Firmware storage size 64KB (32K x 16) for memory capacity. Storage medium FLASH for program retention. The total size of RAM 1K x 32 for system or device specifications. Operational speed 20.48MHz for mechanical or data tasks. Supplier package type 32-LFCSP-VQ (6x6) for component selection. Voltage requirement 3.5V ~ 18V for electrical specifications. Vcc/Vdd voltage supply 3.5V ~ 18V for electronic devices.
