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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Active | |
| Central CPU Unit | Am386®SXLV | |
| Processor Core Dimensions | 32-Bit | |
| Operational Speed Rating | 25MHz | |
| Interconnect Options | UART/USART | |
| External Device Support | DMA, LCD | |
| Input/Output Port Count | - | |
| Firmware Storage Capacity | - | |
| Code Storage Technology | ROMless | |
| Non-Volatile Memory Capacity | - | |
| Random Access Memory Bytes | - | |
| Core Supply Voltage | 3V ~ 5.5V | |
| Analog-Digital Transformers | - | |
| Frequency Generator Category | External, Internal | |
| Ambient Temp Range | 0°C ~ 70°C (TA) | |
| Quality Grade Level | - | |
| Certification Qualification | - | |
| Attachment Mounting Style | Surface Mount | |
| Vendor Package Type | 208-TQFP (28x28) | |
| Component Housing Style | 208-LQFP |
Description
Presents connection choices defined by UART/USART for seamless integration. Includes the core processor identified as Am386®SXLV for swift processing. Designed with core dimensions specified as 32-Bit. Mounting configuration Surface Mount for structural stability. Temperature range 0°C ~ 70°C (TA) for environmental conditions impacting thermal efficiency. Type of generator External, Internal for generating frequency. Type of housing Bulk for safeguarding or transporting components. Style of the enclosure/case 208-LQFP that offers mechanical and thermal protection. Type of package 208-TQFP (28x28) that preserves the integrity of the device. Support for external devices DMA, LCD for system integration and improvement. Product status Active concerning availability and lifecycle. Storage medium ROMless for program retention. Operational speed 25MHz for mechanical or data tasks. Supplier package type 208-TQFP (28x28) for component selection. Voltage requirement 3V ~ 5.5V for electrical specifications. Vcc/Vdd voltage supply 3V ~ 5.5V for electronic devices.
