Attribute
Description
Manufacturer Part Number
CD40105BK3
Manufacturer
Description
IC FIFO ASYNC 16X4 16CFP
Manufacturer Lead Time
1 week
Note : GST will not be applied to orders shipping outside of India

Stock:

Distributor: 160

Quantity Unit Price Ext. Price
10000 ₹ 1,432.90000 ₹ 1,43,29,000.00
1000 ₹ 1,522.79000 ₹ 15,22,790.00
500 ₹ 1,612.68000 ₹ 8,06,340.00
100 ₹ 1,701.68000 ₹ 1,70,168.00
25 ₹ 1,791.57000 ₹ 44,789.25

Stock:

Distributor: 111


Quantity Unit Price Ext. Price
10000 ₹ 1,791.13000 ₹ 1,79,11,300.00
1000 ₹ 1,903.49000 ₹ 19,03,490.00
500 ₹ 2,015.85000 ₹ 10,07,925.00
100 ₹ 2,127.10000 ₹ 2,12,710.00
25 ₹ 2,239.46000 ₹ 55,986.50

Stock:

Distributor: 117


Quantity Unit Price Ext. Price
12 ₹ 2,165.69000 ₹ 25,988.28

Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line -
IC Encapsulation Type Bulk
Availability Status Active
Total Memory Bytes 16 x 4
Primary Function Mode Asynchronous
Transfer Speed Mbps 8MHz
Data Retrieval Speed -
Power Supply Voltage 3 V ~ 18 V
Maximum Supply Current 100µA
Data Bus Flow Direction Uni-Directional
Upgrade Expansion Method Depth, Width
Flag Configuration Support No
Data Retry Function No
First Word Fall Through Buffer No
Ambient Temp Range -55°C ~ 125°C
Attachment Mounting Style Surface Mount
Component Housing Style 16-CFlatPack
Vendor Package Type 16-CFP

Description

Operates with Uni-Directional bus orientation for enhanced signal control. Facilitates a maximum output current level set as Uni-Directional. Manages the maximum supply current noted as 100µA. Delivers a data transfer rate measured at 8MHz for rapid operations. Demonstrates a sampling rate capability indicated as 8MHz. Is compatible with an expansion method recognized as Depth, Width. Offers FWFT setup defined as No. Engineered with Asynchronous features for versatile component usage. Total memory size 16 x 4 for device storage capability. Mounting configuration Surface Mount for structural stability. Temperature range -55°C ~ 125°C for environmental conditions impacting thermal efficiency. Type of housing Bulk for safeguarding or transporting components. Style of the enclosure/case 16-CFlatPack that offers mechanical and thermal protection. Type of package 16-CFP that preserves the integrity of the device. Product status Active concerning availability and lifecycle. Custom flags allow No for device functionalities. Capability to retransmit data No for communication or networking devices. Supplier package type 16-CFP for component selection. Voltage requirement 3 V ~ 18 V for electrical specifications. Voltage supply 3 V ~ 18 V for device operation.