Description

Mounting configuration Surface Mount for structural stability. Overall I/O 26 for electronic connections. Overall LABs/CLBs 440 for FPGA configuration. Overall logic elements/cells 3520 for programmable hardware. Temperature range -40°C ~ 100°C (TJ) for environmental conditions impacting thermal efficiency. Type of housing Tape & Reel (TR)Cut Tape (CT)Digi-Reel® for safeguarding or transporting components. Style of the enclosure/case 36-XFBGA, WLCSP that offers mechanical and thermal protection. Type of package 36-WLCSP (2.1x2.1) that preserves the integrity of the device. Product status Active concerning availability and lifecycle. Classification series for the product or component iCE40 Ultra™. Supplier package type 36-WLCSP (2.1x2.1) for component selection. Voltage requirement 1.14V ~ 1.26V for electrical specifications. Total RAM bits needed 81920 for memory specifications. Voltage supply 1.14V ~ 1.26V for device operation.