Mounting configuration Surface Mount for structural stability. Overall I/O 93 for electronic connections. Overall LABs/CLBs 440 for FPGA configuration. Overall logic elements/cells 3520 for programmable hardware. Temperature range -40°C ~ 100°C (TJ) for environmental conditions impacting thermal efficiency. Type of housing Tray for safeguarding or transporting components. Style of the enclosure/case 121-TFBGA that offers mechanical and thermal protection. Type of package 121-caBGA (9x9) that preserves the integrity of the device. Product status Active concerning availability and lifecycle. Classification series for the product or component iCE40™ HX. Supplier package type 121-caBGA (9x9) for component selection. Voltage requirement 1.14V ~ 1.26V for electrical specifications. Total RAM bits needed 81920 for memory specifications. Voltage supply 1.14V ~ 1.26V for device operation.
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