Mounting configuration Surface Mount for structural stability. Overall I/O 112 for electronic connections. Overall LABs/CLBs 250 for FPGA configuration. Overall logic elements/cells 4000 for programmable hardware. Temperature range 0°C ~ 85°C (TJ) for environmental conditions impacting thermal efficiency. Type of housing Tray for safeguarding or transporting components. Style of the enclosure/case 153-VFBGA that offers mechanical and thermal protection. Type of package 153-MBGA (8x8) that preserves the integrity of the device. Product status Active concerning availability and lifecycle. Classification series for the product or component MAX® 10. Supplier package type 153-MBGA (8x8) for component selection. Voltage requirement 2.85V ~ 3.465V for electrical specifications. Total RAM bits needed 193536 for memory specifications. Voltage supply 2.85V ~ 3.465V for device operation.
Note :
GST will not be applied to orders shipping outside of India
