Description

Utilizes a String DAC architecture to improve effectiveness. Operates through a data interface specified at SPI, DSP. Features a differential output recorded at No. Maintains ±2.4, +0.2 INL/DNL in LSB for precise ADC functionality. Mounting configuration Surface Mount for structural stability. Overall bits 12 ensuring digital precision. The total number of converters is 4 for power or signal transformation. Total D/A converters 4 utilized for transforming digital signals into analog format. Temperature range -40°C ~ 105°C for environmental conditions impacting thermal efficiency. Type Voltage - Buffered for ensuring compatibility with output systems. Type of housing Tape & Reel (TR)Cut Tape (CT)Digi-Reel® for safeguarding or transporting components. Style of the enclosure/case 10-WFDFN Exposed Pad that offers mechanical and thermal protection. Type of package 10-SON (3x3) that preserves the integrity of the device. Product status Active concerning availability and lifecycle. Kind of reference External utilized for component identification. Duration needed for signal stabilization 8.5µs. Supplier package type 10-SON (3x3) for component selection. Voltage supply 2.7V ~ 5.5V for the analog section of circuits. Voltage supplied to digital components 2.7V ~ 5.5V.