Description

Utilizes a R-2R architecture to improve effectiveness. Operates through a data interface specified at SPI. Features a differential output recorded at No. Maintains ±1 (Max), ±0.7 (Max) INL/DNL in LSB for precise ADC functionality. Mounting configuration Surface Mount for structural stability. Overall bits 8 ensuring digital precision. The total number of converters is 8 for power or signal transformation. Total D/A converters 8 utilized for transforming digital signals into analog format. Temperature range -30°C ~ 85°C for environmental conditions impacting thermal efficiency. Type Voltage - Buffered for ensuring compatibility with output systems. Type of housing Tape & Reel (TR) for safeguarding or transporting components. Style of the enclosure/case 16-WFQFN Exposed Pad that offers mechanical and thermal protection. Type of package 16-QFN (3x3) that preserves the integrity of the device. Product status Not For New Designs concerning availability and lifecycle. Kind of reference External utilized for component identification. Duration needed for signal stabilization 150µs. Supplier package type 16-QFN (3x3) for component selection. Voltage supply 2.7V ~ 5.5V for the analog section of circuits. Voltage supplied to digital components 2.7V ~ 5.5V.