Description

Utilizes a String DAC architecture to improve effectiveness. Operates through a data interface specified at SPI, DSP. Features a differential output recorded at No. Maintains ±1 (Max), ±1 (Max) INL/DNL in LSB for precise ADC functionality. Mounting configuration Surface Mount for structural stability. Overall bits 12 ensuring digital precision. The total number of converters is 2 for power or signal transformation. Total D/A converters 2 utilized for transforming digital signals into analog format. Temperature range -40°C ~ 85°C for environmental conditions impacting thermal efficiency. Type Voltage - Buffered for ensuring compatibility with output systems. Type of housing Tape & Reel (TR)Cut Tape (CT)Digi-Reel® for safeguarding or transporting components. Style of the enclosure/case 24-TSSOP (0.173", 4.40mm Width) Exposed Pad that offers mechanical and thermal protection. Type of package 24-TSSOP-EP that preserves the integrity of the device. Product status Active concerning availability and lifecycle. Kind of reference External utilized for component identification. Classification series for the product or component iCMOS®. Duration needed for signal stabilization 12µs. Supplier package type 24-TSSOP-EP for component selection. Voltage supply ±4.5V ~ 16.5V for the analog section of circuits. Voltage supplied to digital components 2.7V ~ 5.5V.