Description

Engineered with Controller features for versatile component usage. Designed for MII, RMII ease of use and user interaction. Temperature range -40°C ~ 85°C for environmental conditions impacting thermal efficiency. Type of housing Tray for safeguarding or transporting components. Style of the enclosure/case 64-VFQFN Exposed Pad that offers mechanical and thermal protection. Type of package 64-QFN (8x8) that preserves the integrity of the device. Product status Obsolete concerning availability and lifecycle. Protocol for communication Ethernet for control or interaction. Regulatory compliance criteria 10/100 Base-T/TX PHY for industry norms. Supplier package type 64-QFN (8x8) for component selection.