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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Active | |
| Communication Standard | PCI | |
| Primary Function Mode | Bridge | |
| User Interface Type | PCI, Serial | |
| Industry Standards Met | IEEE 1149.1 | |
| Power Supply Voltage | 1.14V ~ 1.26V | |
| Power Supply Amperage | - | |
| Ambient Temp Range | 0°C ~ 70°C | |
| Component Housing Style | 829-BBGA, FCBGA | |
| Vendor Package Type | 829-FCBGA (31x31) | |
| Quality Grade Level | - | |
| Certification Qualification | - |
Description
Engineered with Bridge features for versatile component usage. Designed for PCI, Serial ease of use and user interaction. Temperature range 0°C ~ 70°C for environmental conditions impacting thermal efficiency. Type of housing Bulk for safeguarding or transporting components. Style of the enclosure/case 829-BBGA, FCBGA that offers mechanical and thermal protection. Type of package 829-FCBGA (31x31) that preserves the integrity of the device. Product status Active concerning availability and lifecycle. Protocol for communication PCI for control or interaction. Regulatory compliance criteria IEEE 1149.1 for industry norms. Supplier package type 829-FCBGA (31x31) for component selection. Voltage requirement 1.14V ~ 1.26V for electrical specifications. Voltage supply 1.14V ~ 1.26V for device operation.
