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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Bulk | |
| Availability Status | Active | |
| Communication Standard | PCI | |
| Primary Function Mode | Bridge | |
| User Interface Type | PCI, Serial | |
| Industry Standards Met | - | |
| Power Supply Voltage | 1.14V ~ 1.26V, 1.71V ~ 1.89V, 3.135V ~ 3.465V | |
| Power Supply Amperage | - | |
| Ambient Temp Range | 0°C ~ 70°C | |
| Component Housing Style | 829-BBGA | |
| Vendor Package Type | 829-BGA (37.5x37.5) | |
| Quality Grade Level | - | |
| Certification Qualification | - |
Description
Engineered with Bridge features for versatile component usage. Designed for PCI, Serial ease of use and user interaction. Temperature range 0°C ~ 70°C for environmental conditions impacting thermal efficiency. Type of housing Bulk for safeguarding or transporting components. Style of the enclosure/case 829-BBGA that offers mechanical and thermal protection. Type of package 829-BGA (37.5x37.5) that preserves the integrity of the device. Product status Active concerning availability and lifecycle. Protocol for communication PCI for control or interaction. Supplier package type 829-BGA (37.5x37.5) for component selection. Voltage requirement 1.14V ~ 1.26V, 1.71V ~ 1.89V, 3.135V ~ 3.465V for electrical specifications. Voltage supply 1.14V ~ 1.26V, 1.71V ~ 1.89V, 3.135V ~ 3.465V for device operation.
