Attribute
Description
Manufacturer Part Number
TC74LVX125FTELM
Description
IC BUFF NON-INVERT 3.6V 14-TSSOP
Manufacturer Lead Time
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Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line TC74LVX
IC Encapsulation Type Tape & Reel (TR)
Availability Status Active
Digital Logic Family Buffer, Non-Inverting
Component Element Total 4
Bits per Data Element 1
Entry Signal Category -
Exit Signal Category 3-State
High/Low Logic Current 4mA, 4mA
Power Supply Voltage 2V ~ 3.6V
Ambient Temp Range -40°C ~ 85°C (TA)
Quality Grade Level -
Certification Qualification -
Attachment Mounting Style Surface Mount
Component Housing Style 14-TSSOP (0.173", 4.40mm Width)
Vendor Package Type 14-TSSOP

Description

Facilitates a maximum output current level set as 4mA, 4mA. Offers information on high and low output current settings at 4mA, 4mA. The type of logic Buffer, Non-Inverting that guarantees maximum compatibility in electronic design. Mounting configuration Surface Mount for structural stability. Bits per data item 1 for memory or ADC precision. Total elements 4 present in circuits or arrays. Temperature range -40°C ~ 85°C (TA) for environmental conditions impacting thermal efficiency. Type 3-State for ensuring compatibility with output systems. Type of housing Tape & Reel (TR) for safeguarding or transporting components. Style of the enclosure/case 14-TSSOP (0.173", 4.40mm Width) that offers mechanical and thermal protection. Type of package 14-TSSOP that preserves the integrity of the device. Product status Active concerning availability and lifecycle. Classification series for the product or component TC74LVX. Dimensions of the shell Buffer, Non-Inverting for connectors or enclosures. Supplier package type 14-TSSOP for component selection. Voltage requirement 2V ~ 3.6V for electrical specifications. Voltage supply 2V ~ 3.6V for device operation.