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Product Attributes
| Type | Description | |
|---|---|---|
| Category | ||
| Import Duty Classification | - | |
| Product Series Line | - | |
| IC Encapsulation Type | Tray | |
| Availability Status | Obsolete | |
| Digital Logic Family | Buffer, Driver | |
| Component Element Total | 2 | |
| Bits per Data Element | 4 | |
| Entry Signal Category | - | |
| Exit Signal Category | 3-State | |
| High/Low Logic Current | - | |
| Power Supply Voltage | 4.5V ~ 5.5V | |
| Ambient Temp Range | -55°C ~ 125°C | |
| Quality Grade Level | - | |
| Certification Qualification | - | |
| Attachment Mounting Style | Surface Mount | |
| Component Housing Style | 20-CFlatPack | |
| Vendor Package Type | 20-CFlatPack |
Description
The type of logic Buffer, Driver that guarantees maximum compatibility in electronic design. Mounting configuration Surface Mount for structural stability. Bits per data item 4 for memory or ADC precision. Total elements 2 present in circuits or arrays. Temperature range -55°C ~ 125°C for environmental conditions impacting thermal efficiency. Type 3-State for ensuring compatibility with output systems. Type of housing Tray for safeguarding or transporting components. Style of the enclosure/case 20-CFlatPack that offers mechanical and thermal protection. Type of package 20-CFlatPack that preserves the integrity of the device. Product status Obsolete concerning availability and lifecycle. Dimensions of the shell Buffer, Driver for connectors or enclosures. Supplier package type 20-CFlatPack for component selection. Voltage requirement 4.5V ~ 5.5V for electrical specifications. Voltage supply 4.5V ~ 5.5V for device operation.
