Attribute
Description
Manufacturer Part Number
74AXP2T3407GNX
Manufacturer
Description
IC BUFF NON-INVERT 2.75V 8-XSON
Manufacturer Lead Time
53 weeks
Note : GST will not be applied to orders shipping outside of India

Stock:

Distributor: 160

Quantity Unit Price Ext. Price
100000 ₹ 25.95000 ₹ 25,95,000.00
10000 ₹ 30.97000 ₹ 3,09,700.00
1000 ₹ 34.74000 ₹ 34,740.00
500 ₹ 37.67000 ₹ 18,835.00
100 ₹ 41.86000 ₹ 4,186.00

Stock:

Distributor: 111


Quantity Unit Price Ext. Price
100000 ₹ 32.44000 ₹ 32,44,000.00
10000 ₹ 38.71000 ₹ 3,87,100.00
1000 ₹ 43.42000 ₹ 43,420.00
709 ₹ 47.09000 ₹ 33,386.81

Stock:

Distributor: 130


Quantity Unit Price Ext. Price
1 ₹ 47.93000 ₹ 47.93
10 ₹ 33.63000 ₹ 336.30
100 ₹ 32.96000 ₹ 3,296.00
500 ₹ 32.29000 ₹ 16,145.00
1000 ₹ 31.62000 ₹ 31,620.00
2500 ₹ 30.95000 ₹ 77,375.00
5000 ₹ 30.28000 ₹ 1,51,400.00

Stock:

Distributor: 117


Quantity Unit Price Ext. Price
510 ₹ 50.79000 ₹ 25,902.90

Product Attributes

Type Description
Category
Import Duty Classification -
Product Series Line 74AXP
IC Encapsulation Type Bulk
Availability Status Not For New Designs
Digital Logic Family Buffer, Non-Inverting
Component Element Total 2
Bits per Data Element 1
Entry Signal Category -
Exit Signal Category Open Drain
High/Low Logic Current 12mA, 12mA
Power Supply Voltage 0.7V ~ 2.75V
Ambient Temp Range -40°C ~ 85°C (TA)
Quality Grade Level -
Certification Qualification -
Attachment Mounting Style Surface Mount
Component Housing Style 8-XFDFN
Vendor Package Type 8-XSON (1.2x1)

Description

Facilitates a maximum output current level set as 12mA, 12mA. Offers information on high and low output current settings at 12mA, 12mA. The type of logic Buffer, Non-Inverting that guarantees maximum compatibility in electronic design. Mounting configuration Surface Mount for structural stability. Bits per data item 1 for memory or ADC precision. Total elements 2 present in circuits or arrays. Temperature range -40°C ~ 85°C (TA) for environmental conditions impacting thermal efficiency. Type Open Drain for ensuring compatibility with output systems. Type of housing Bulk for safeguarding or transporting components. Style of the enclosure/case 8-XFDFN that offers mechanical and thermal protection. Type of package 8-XSON (1.2x1) that preserves the integrity of the device. Product status Not For New Designs concerning availability and lifecycle. Classification series for the product or component 74AXP. Dimensions of the shell Buffer, Non-Inverting for connectors or enclosures. Supplier package type 8-XSON (1.2x1) for component selection. Voltage requirement 0.7V ~ 2.75V for electrical specifications. Voltage supply 0.7V ~ 2.75V for device operation.